Moisture diffusion in BCB resins used for MEMS packaging

Author： Tetelin A. Pellet C. Deletage J.-Y. Carbonne B. Danto Y.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1939-1944

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