Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate

By Yoon J.-W.   Lee C.-B.   Jung S.-B.  

Materials Science and Technology, Vol. 19, Iss. 8, 2003-08 ,pp. : 1101-1106

Maney Publishing

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Formation of intermetallic compounds with Sn–Zn–Al solder on copper and electroless nickel–immersion gold substrates

By Snugovsky L.   Snugovsky P.   Perovic D. D.   Rutter J. W.  

Materials Science and Technology, Vol. 23, Iss. 10, 2007-10 ,pp. : 1161-1166

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Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

By Zhang K K   Li C Y   Qiu R F   Shi H X   Wang Y L  

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Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

By Li F. Q.   Wang C. Q.   Tian Y. H.  

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FORMATION AND GROWTH OF COMPOUND LAYER ON NITROCARBURIZING IRON: KINETICS AND MICROSTRUCTURAL EVOLUTION

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