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By Kim D.-G.   Jung H.-S.   Jung S.-B.  

Materials Science and Technology, Vol. 21, Iss. 3, 2005-03 ,pp. : 381-386

Maney Publishing

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The influence of nano-particles on microstructural development at the interface of Sn3.5Ag-solder and Cu-substrate

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Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

By Zhang K K   Li C Y   Qiu R F   Shi H X   Wang Y L  

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Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

By Snugovsky L.   Snugovsky P.   Perovic D. D.   Sack T.   Rutter J. W.  

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Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

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