Integrating copper at the nanometer length scale with Sn–3·5Ag solder to develop high performance nanocomposites

Author： Babaghorbani P.   Nai S. M. L.   Gupta M.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.25, Iss.10, 2009-10, pp. : 1258-1264

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