Period of time: 2014年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1974
Total resources: 123
ISSN: 0305-6120
Subject: TM Electrotechnical
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Circuit World,volume 21,issue 3
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A Photoimageable Dielectric for Sequential PWB Fabrication
By Knudsen P.D.,Brainard R.L.,Schell K.T. in (1993)
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.A New Strategy in the Recycling of Printed Circuit Boards
By Legarth J.B.,Alting L.,Danzer B.,Tartler D.,Brodersen K.,Scheller H.,Feldmann K. in (1993)
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.By Vasan S.V.,Truong P.T.,Dody G. in (1993)
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.Design and Procurement of Eutectic Sn/Pb Solder-bumped Flip Chip Test Die and Organic Substrates
By Lau J.,Heydinger M.,Glazer J.,Uno D. in (1993)
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.The Adhesion Promotion and Metallisation Process: The Critical Step in MID Manufacturing
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.X-ray Inspection of Flip Chip Attach Using Digital Tomosynthesis
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.High Strength, Low Profile Copper Foil for High Performance PCBs
By Chiang S.K.,DiFranco D.F.,Pucci D.G. in (1993)
Circuit World,volume 21,issue 3 , Vol. 21, Iss. 3, 1993-12 , pp.