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Circuit World, Vol. 28, Iss. 1, 2002-10 ,pp. : 14-20

Emerald Group Publishing Ltd

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Flip Chip Rework Process

By Vasan S.V.   Truong P.T.   Dody G.  

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Development of Flip-chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*

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Emerald Group Publishing Ltd

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Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

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Emerald Group Publishing Ltd

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A novel flip-chip interconnection process for integrated circuits

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Emerald Group Publishing Ltd

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