Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

By Peng Changfei   Shen Jun   Xie Weidong   Chen Jie   Wu Cuiping   Wang Xiaochuan  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

Springer Publishing Company

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

By Tian Yanhong  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 136-147

Springer Publishing Company

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The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

By Tseng Chien-Fu   Duh Jenq-Gong  

Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

Springer Publishing Company

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Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder

By Saud N.   Jalar A.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 10, 2010-10 ,pp. : 1083-1089

Springer Publishing Company

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