Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites

By Hsiang Hsing-I   Lyu Bing Jyun   Mei Li-Then   Hsi Chi-Shiung  

International Journal of Applied Ceramic Technology, Vol. 11, Iss. 3, 2014-05 ,pp. : 496-501

Blackwell Publishing

Access to resources Recommend Favorite

Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

Springer Publishing Company

Access to resources Recommend Favorite

Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

By Yoon Jeong-Won   Noh Bo-In   Choi Jung-Hyun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 745-750

Springer Publishing Company

Access to resources Recommend Favorite