Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

Author: Maung Latt K.   Sher-Yi C.   Osipowicz T.   Lee K.   Lee Y.K.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.36, Iss.23, 2001-12, pp. : 5705-5712

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Abstract