A study of Sn-Bi-Ag-(In) lead-free solders

Author： Shiue R-K.   Tsay L-W.   Lin C-L.   Ou J-L.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.38, Iss.6, 2003-03, pp. : 1269-1279

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders

By Wang X.   Xiu Y.   Dong M.   Liu Y.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 6, 2011-06 ,pp. : 592-595

Springer Publishing Company

Access to resources Recommend Favorite

Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders

By Lin Chih-Kuang   Chu De-You  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 6, 2005-06 ,pp. : 355-365

Springer Publishing Company

Access to resources Recommend Favorite

Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

By Nakamura Y.   Ono T.  

Journal of Materials Science, Vol. 40, Iss. 12, 2005-06 ,pp. : 3267-3269

Springer Publishing Company

Access to resources Recommend Favorite

Dependence of frequency on Young's modulus and internal friction in Sn–9Zn and Sn–3.5Ag eutectic lead-free solders

By Ohoka T.   Nakamura Y.   Ono T.  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4379-4381

Springer Publishing Company

Access to resources Recommend Favorite

Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity

By Shohji I.   Yoshida T.   Takahashi T.   Hioki S.  

Materials Science and Engineering: A, Vol. 366, Iss. 1, 2004-02 ,pp. : 50-55

Elsevier

Access to resources Recommend Favorite