Related content

A study of Sn-Bi-Ag-(In) lead-free solders

By Shiue R-K.   Tsay L-W.   Lin C-L.   Ou J-L.  

Journal of Materials Science, Vol. 38, Iss. 6, 2003-03 ,pp. : 1269-1279

Springer Publishing Company

Access to resources Recommend Favorite

Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

By Nakamura Y.   Ono T.  

Journal of Materials Science, Vol. 40, Iss. 12, 2005-06 ,pp. : 3267-3269

Springer Publishing Company

Access to resources Recommend Favorite

Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

By Shohji Ikuo   Yoshida Tomohiro   Takahashi Takehiko   Hioki Susumu  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 219-223

Springer Publishing Company

Access to resources Recommend Favorite

The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders

By Wang X.   Xiu Y.   Dong M.   Liu Y.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 6, 2011-06 ,pp. : 592-595

Springer Publishing Company

Access to resources Recommend Favorite

Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders

By Lin Chih-Kuang   Chu De-You  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 6, 2005-06 ,pp. : 355-365

Springer Publishing Company

Access to resources Recommend Favorite