Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 56-60

Springer Publishing Company

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Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

By Çadırlı E.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 31-40

Springer Publishing Company

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

Springer Publishing Company

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Effects of electromigration on resistance changes in eutectic SnBi solder joints

By Sun Jia   Xu Guangchen   Guo Fu   Xia Zhidong   Lei Yongping   Shi Yaowu   Li Xiaoyan   Wang Xitao  

Journal of Materials Science, Vol. 46, Iss. 10, 2011-05 ,pp. : 3544-3549

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Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

By Wu B.   Zhong H.   Chan Y.   Alam M.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 11, 2006-11 ,pp. : 943-950

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