Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging

Author: Kim Dae-Gon   Jang Hyung-Sun   Kim Jong-Woong   Jung Seung-Boo  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.16, Iss.9, 2005-09, pp. : 603-609

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content