Electromigration issues in lead-free solder joints

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Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 259-268

Springer Publishing Company

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Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water

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Standardization of a shear test method for lead-free solder paste chip joints

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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

By Swenson D.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 39-54

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The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

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Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1369-1374

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