Electromigration issues in lead-free solder joints

By Chen Chih   Liang S.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 259-268

Springer Publishing Company

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 136-147

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Electrochemical migration of lead free solder joints

By Yu D.   Jillek W.   Schmitt E.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 3, 2006-03 ,pp. : 229-241

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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

By Swenson D.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 39-54

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The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

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Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1369-1374

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