Standardization of a shear test method for lead-free solder paste chip joints

By Choi Jai-Kyoung   Park Jai-Hyun   Ahn Yong-Sik  

Journal of Materials Science, Vol. 42, Iss. 17, 2007-09 ,pp. : 7451-7456

Springer Publishing Company

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Electrochemical migration of lead free solder joints

By Yu D.   Jillek W.   Schmitt E.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 3, 2006-03 ,pp. : 229-241

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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

By Swenson D.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 39-54

Springer Publishing Company

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The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

By Yin Limeng  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1369-1374

Springer Publishing Company

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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

By Chae Seung-Hyun   Zhang Xuefeng   Lu Kuan-Hsun   Chao Huang-Lin   Ho Paul   Ding Min   Su Peng   Uehling Trent   Ramanathan Lakshmi  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 247-258

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