Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.1-3, 2007-03, pp. : 155-174
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Composite lead-free electronic solders
By Guo Fu
Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. :
By Puttlitz Karl Galyon George
Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. :
A study of Sn-Bi-Ag-(In) lead-free solders
By Shiue R-K. Tsay L-W. Lin C-L. Ou J-L.
Journal of Materials Science, Vol. 38, Iss. 6, 2003-03 ,pp. :