Processing and material issues related to lead-free soldering

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.18, Iss.1-3, 2007-03, pp. : 147-154

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Electromigration issues in lead-free solder joints

By Chen Chih Liang S.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 259-268

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial reaction issues for lead-free electronic solders

By Ho C. Yang S. Kao C.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 155-174

Springer Publishing Company

Access to resources Recommend Favorite

Tin pest issues in lead-free electronic solders

By Plumbridge W.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 307-318

Springer Publishing Company

Access to resources Recommend Favorite

Alkaline niobate based lead-free ceramic fiber/polymer 1-3 composites: processing and electromechanical properties

By Ma Bing

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 11, 2011-11 ,pp. : 1697-1702

Springer Publishing Company

Access to resources Recommend Favorite

Composite lead-free electronic solders

By Guo Fu

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 129-145

Springer Publishing Company

Access to resources Recommend Favorite