Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By Anderson Iver  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 55-76

Springer Publishing Company

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Measurement and prediction of Young’s modulus of a Pb-free solder

By Chawla N.   Ochoa F.   Ganesh V. V.   Deng X.   Koopman M.   Chawla K. K.   Scarritt S.  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 6, 2004-06 ,pp. : 385-388

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Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

By Chawla N.   Sidhu R.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 175-189

Springer Publishing Company

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Mechanical fatigue of Sn-rich Pb-free solder alloys

By Shang J.   Zeng Q.   Zhang L.   Zhu Q.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 211-227

Springer Publishing Company

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Issues related to the implementation of Pb-free electronic solders in consumer electronics

By Frear D.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 319-330

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