Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

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Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 7, 2013-07 ,pp. : 2527-2536

Springer Publishing Company

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Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

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Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures

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Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

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Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

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