Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 124-129

Springer Publishing Company

Access to resources Recommend Favorite

Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

By Yang Shihua   Tian Yanhong   Wang Chunqing  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 11, 2010-11 ,pp. : 1174-1180

Springer Publishing Company

Access to resources Recommend Favorite

Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 56-60

Springer Publishing Company

Access to resources Recommend Favorite

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By Anderson Iver  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 55-76

Springer Publishing Company

Access to resources Recommend Favorite

The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

Access to resources Recommend Favorite