Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

Author: Zhang Liang   Xue Song-bai   Gao Li-li   Chen Yan   Yu Sheng-lin   Sheng Zhong   Zeng Guang  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.22, Iss.2, 2010-01, pp. : 30-36

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Abstract