A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections

Author: Rönkä K.   Loo F.   Kivilahti J.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.29, Iss.12, 1998-12, pp. : 2951-2956

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Abstract