Reliability testing and data analysis of lead-free solder joints for high-density packages

By Lau John   Hoo Nick   Horsley Rob   Smetana Joe   Shangguan Dongkai   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 46-68

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Design for lead-free solder joint reliability of high-density packages

By Lau John   Dauksher Walter   Smetana Joe   Horsley Rob   Shangguan Dongkai   Castello Todd   Menis Irv   Love Dave   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 12-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Design, materials and process for lead-free assembly of high-density packages

By Smetana Joe   Horsley Rob   Lau John   Snowdon Ken   Shangguan Dongkai   Gleason Jerry   Memis Irv   Love Dave   Dauksher Walter   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 53-62

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Experimental investigation on the failure of lead-free solder joints under drop impact

By Liu Fang   Meng Guang   Zhao Mei  

Soldering & Surface Mount Technology, Vol. 22, Iss. 3, 2010-01 ,pp. : 36-41

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Process characterization of PCB assembly using 0201 packages with lead-free solder

By Geiger David   Mattsson Fredrik   Shangguan Dongkai   Ong MT   Wong Patrick   Wang Mei   Castello Todd   Yi Sammy  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 22-27

Emerald Group Publishing Ltd

Access to resources Recommend Favorite