Reliability testing and data analysis of lead-free solder joints for high-density packages

By Lau John   Hoo Nick   Horsley Rob   Smetana Joe   Shangguan Dongkai   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 46-68

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Failure analysis of lead-free solder joints for high-density packages

By Lau John   Shangguan Dongkai   Castello Todd   Horsley Rob   Smetana Joe   Hoo Nick   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 69-76

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Design, materials and process for lead-free assembly of high-density packages

By Smetana Joe   Horsley Rob   Lau John   Snowdon Ken   Shangguan Dongkai   Gleason Jerry   Memis Irv   Love Dave   Dauksher Walter   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 53-62

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Solidification and reliability of lead-free solder interconnection

By Yu Hao   Shangguan Dongkai  

Soldering & Surface Mount Technology, Vol. 25, Iss. 1, 2013-02 ,pp. : 31-38

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

By Lee Shi-Wei Ricky   Lui Ben Hoi Wai   Kong Y.H.   Baylon Bernard   Leung Timothy   Umali Pompeo   Agtarap Hector  

Soldering & Surface Mount Technology, Vol. 14, Iss. 3, 2002-12 ,pp. : 46-50

Emerald Group Publishing Ltd

Access to resources Recommend Favorite