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Springer Publishing Company

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Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

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Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

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In-Situ Observation of the Behavior of Liquid Oxides during the Application of an Electric Potential: Precipitation of Platinum and Platinum Rhodium Particles

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