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By Vianco Paul   Rejent Jerome   Zender Gary   Hlava Paul  

Metallurgical and Materials Transactions A, Vol. 41, Iss. 12, 2010-12 ,pp. : 3042-3052

Springer Publishing Company

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Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

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Metallurgical and Materials Transactions A, Vol. 37, Iss. 5, 2006-05 ,pp. : 1551-1561

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In-Situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy

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In-Situ Observation on Microfracture Behavior Ahead of the Crack Tip in 63Sn37Pb Solder Alloy

By Ding Ying   Wang Chunqing   Tian Yanhong   Zhang Binbin  

Metallurgical and Materials Transactions A, Vol. 37, Iss. 3, 2006-03 ,pp. : 1017-1025

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Pb-Free Solders: Part II. Application of ADAMIS Database in Modeling of Sn-Ag-Cu Alloys with Bi Additions

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