Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

Author: Vianco Paul   Wright Robert   Hlava Paul   Martin Joseph  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.37, Iss.5, 2006-05, pp. : 1551-1561

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract