Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers

Author： Sasangka Wardhana A   Lai Donny   Thompson Carl V   Sasangka Wardhana A   Sasangka Wardhana A  

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|3|35023-35036

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.3, 2015-03, pp. : 35023-35036

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