Effect of process parameters on sidewall damage in deep silicon etch

Author: Meng Lingkuan   Yan Jiang  

Publisher: IOP Publishing

E-ISSN: 1361-6439|25|3|35024-35031

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.3, 2015-03, pp. : 35024-35031

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Abstract