Simultaneous filling of through silicon vias (TSVs) with different aspect ratios using multi-step direct current density

By Wang Zhaoyu   Wang Hong   Cheng Ping   Ding Guifu   Zhao Xiaolin  

Journal of Micromechanics and Microengineering, Vol. 24, Iss. 8, 2014-08 ,pp. : 85013-85020

IOP Publishing

Access to resources Recommend Favorite

A novel bottom–up copper filling of blind silicon vias in 3D electronic packaging

By Du Li   Shi Tielin   Su Lei   Xue Dongmin   Liao Guanglan  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 4, 2015-04 ,pp. : 45005-45011

IOP Publishing

Access to resources Recommend Favorite

Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: a multi-scale modeling approach

By  

Nanotechnology, Vol. 26, Iss. 48, 2015-12 ,pp. : 485705-485720

IOP Publishing

Access to resources Recommend Favorite

The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step

By Dixit Pradeep   Salonen Jaakko   Pohjonen Harri   Monnoyer Philippe  

Journal of Micromechanics and Microengineering, Vol. 21, Iss. 2, 2011-02 ,pp. : 25020-25030

IOP Publishing

Access to resources Recommend Favorite

Design, simulation and fabrication of a flexible bond pad with a hollow annular protuberance to improve the thermal fatigue lifetime for through-silicon vias

By  

Journal of Micromechanics and Microengineering, Vol. 24, Iss. 12, 2014-12 ,pp. : 125017-125024

IOP Publishing

Access to resources Recommend Favorite