Excellent passivation of thin silicon wafers by HF‐free hydrogen plasma etching using an industrial ICPECVD tool

Publisher: John Wiley & Sons Inc

E-ISSN: 1862-6270|9|1|47-52

ISSN: 1862-6254

Source: PHYSICA STATUS SOLIDI - RAPID RESEARCH LETTERS (ELECTRONIC), Vol.9, Iss.1, 2015-01, pp. : 47-52

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract