Application of a macromolecular chelating agent in chemical mechanical polishing of copper film under the condition of low pressure and low abrasive concentration

Author： Yan Li   Yuling Liu   Xinhuan Niu   Xiaofeng Bu   Hongbo Li   Jiying Tang   Shiyan Fan  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.35, Iss.1, 2014-01, pp. : 16001-16005

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