Dynamic reliability approach of chip scale package assembly under vibration environment

Author： Yang Ping Tang Xiusheng Liu Yu Wang Shuting Yang Jianming

ISSN： 1356-5362

Source： Microelectronics International, Vol.31, Iss.2, 2014-04, pp. : 71-77

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation

By Shohji I. Mori H. Orii Y.

Microelectronics Reliability, Vol. 44, Iss. 2, 2004-02 ,pp. : 269-274

Elsevier

Access to resources Recommend Favorite

Effects of chip scale package and flip-chip on the design and manufacturing of electronic products

By Savolainen Petri

Microelectronics International, Vol. 15, Iss. 1, 1998-01 ,pp. : 35-38

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Assembly and Reliability of Very Large Flip-chip on CQFP*

By Clementi J J Dearing** G 0 Bergeron*** C

Microelectronics International, Vol. 13, Iss. 2, 1996-02 ,pp. : 5-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package

By Lee K.-O.

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 706-711

Springer Publishing Company

Access to resources Recommend Favorite

Improving the deflection of wire bonds in stacked chip scale package (CSP)

By Yao Y.F. Lin T.Y. Chua K.H.

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2039-2045

Elsevier

Access to resources Recommend Favorite