A physical model to describe the distribution of adhesion strength in MEMS, or why one MEMS device sticks and another ‘identical’ one does not

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|12|125012-125023

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.12, 2015-12, pp. : 125012-125023

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of temperature on nano-scale adhesion for MEMS

By Ningbo Liao Ping Yang

International Journal of Materials and Product Technology, Vol. 31, Iss. 2-3, 2008-04 ,pp. : 354-364

Inderscience Publishers

Access to resources Recommend Favorite

MODELING AND SIMULATION OF PIEZOELECTRIC MEMS ENERGY HARVESTING DEVICE

By Lin J. H. Wu X. M. Ren T. L. Liu L. T.

Integrated Ferroelectrics, Vol. 95, Iss. 1, 2007-12 ,pp. : 128-141

Taylor & Francis Ltd

Access to resources Recommend Favorite

Strength analysis of MEMS gyro elastic suspensions

By Evstifeev M. Rozentsvein D. Chelpanov I.

Gyroscopy and Navigation, Vol. 1, Iss. 4, 2010-10 ,pp. : 263-271

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Influence of aluminum nitride crystal orientation on MEMS energy harvesting device performance

By Jackson Nathan O’Keeffe Rosemary Waldron Finbarr O’Neill Mike Mathewson Alan

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 7, 2013-07 ,pp. : 75014-75022

IOP Publishing

Access to resources Recommend Favorite

MEMS fabrication

By Huff Michael

Sensor Review, Vol. 22, Iss. 1, 2002-02 ,pp. : 18-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite