SOI wafer mold with high-aspect-ratio microstructures for hot embossing process

Author： Zhao Y.   Cui T.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.6-7, 2004-10, pp. : 544-546

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Replication of high-aspect-ratio nanopillar array for biomimetic gecko foot-hair prototype by UV nano embossing with anodic aluminum oxide mold

By Kim Dong   Lee Hyun   Lee Junghyun   Kim Sungjoo   Lee Kun-Hong   Moon Wonkyu   Kwon Tai  

Microsystem Technologies, Vol. 13, Iss. 5-6, 2007-03 ,pp. : 601-606

Springer Publishing Company

Access to resources Recommend Favorite

Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

By Cao D.   Jiang J.   Meng W.   Jiang J.   Wang W.  

Microsystem Technologies, Vol. 13, Iss. 5-6, 2007-03 ,pp. : 503-510

Springer Publishing Company

Access to resources Recommend Favorite

High throughput projection UV lithography of high-aspect-ratio thick SU-8 microstructures

By Yang Ren  

Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. : 1233-1243

Springer Publishing Company

Access to resources Recommend Favorite

Rapid replication of powder composite high-aspect-ratio microstructures using silicone rubber micromolds

By Yang Guohua  

Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. : 1663-1667

Springer Publishing Company

Access to resources Recommend Favorite

Manufacturing of microstructures with high aspect ratio by micromachining

By Gietzelt T.  

Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. : 1525-1529

Springer Publishing Company

Access to resources Recommend Favorite