A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200 °C

Author： Hellín Rico R.   Celis J.-P.   Baert K.   Hoof C.   Witvrouw A.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.13, Iss.11-12, 2007-07, pp. : 1451-1456

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