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Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 92-99

Emerald Group Publishing Ltd

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Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement

By Xia Weisheng   Xiao Ming   Chen Yihao   Wu Fengshun   Liu Zhe   Fu Hongzhi  

Soldering & Surface Mount Technology, Vol. 26, Iss. 3, 2014-05 ,pp. : 162-171

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Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

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Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. : 61-68

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Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*

By Lichtenberg L R   Gillespie P J  

Soldering & Surface Mount Technology, Vol. 9, Iss. 1, 1997-01 ,pp. : 13-16

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Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

By Lau Chun-Sean   Abdullah M.Z.   Ani F. Che  

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 77-91

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