Solder Ball Robustness Comparison between SAC 387 and Polymer Solder Balls under AC and TC Reliability Test

Publisher: Trans Tech Publications

E-ISSN: 1662-7482|2015|789|61-65

ISSN: 1660-9336

Source: Applied Mechanics and Materials, Vol.2015, Iss.789, 2015-10, pp. : 61-65

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Abstract