Effect of Copper and Zinc on Microstructures, Melting Points and Corrosion Resistance of Sn-Zn-Cu-Bi Soldering Alloys

Publisher： Trans Tech Publications

E-ISSN： 1662-9795|2015|658|59-63

ISSN： 1013-9826

Source： Key Engineering Materials, Vol.2015, Iss.658, 2015-08, pp. : 59-63

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of SnAgCu composition on soldering performance

By Huang Benlih   Dasgupta Arnab   Lee Ning-Cheng  

Soldering & Surface Mount Technology, Vol. 17, Iss. 3, 2005-09 ,pp. : 9-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu Substrate

By  

Key Engineering Materials, Vol. 2016, Iss. 700, 2016-08 ,pp. : 113-122

Trans Tech Publications

Access to resources Recommend Favorite

Influence of Ageing on the Corrosion Resistance of the ZnAl22Cu3 and ZnAl40Cu3 Alloys

By  

Solid State Phenomena, Vol. 2015, Iss. 227, 2015-03 ,pp. : 31-5

Trans Tech Publications

Access to resources Recommend Favorite

Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance ‐ ANOVA

By Bukat K.   Sitek J.   Kisiel R.   Moser Z.   Gasior W.   Koscielski M.   Pstrus J.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 9-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effects of Sb and Zn Addition on Mechanical Properties and Corrosion Resistance of Sn–Ag–Cu Solders

By  

Key Engineering Materials, Vol. 2017, Iss. 728, 2017-03 ,pp. : 129-134

Trans Tech Publications

Access to resources Recommend Favorite