The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

By Kim Keun-Soo   Suganuma Katsuaki   Hwang Chi-Won   Kim Jong-Min  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 39-43

Springer Publishing Company

Access to resources Recommend Favorite

Digital Auto-Tuning for Center Frequency and Q-Factor of Gm-C Band-Pass Filter

By  

Key Engineering Materials, Vol. 2015, Iss. 643, 2015-06 ,pp. : 123-130

Trans Tech Publications

Access to resources Recommend Favorite

Conversion of Laser Pulse Optical Energy to Photo-acoustic Wave in nm-Scale Layered TlGaSe2 Crystals

By  

IOP Conference Series: Materials Science and Engineering, Vol. 68, Iss. 1, 2014-11 ,pp. : 16-20

IOP Publishing

Access to resources Recommend Favorite

Ceramic chip scale package solder joint reliability

By Seyyedi J.   Padgett J.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 3, 2001-12 ,pp. : 7-11

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Improving the fatigue life of a bare die flip chip by thinning

By Alander T.   Suominen I.   Heino P.   Ristolainen E.  

Soldering & Surface Mount Technology, Vol. 15, Iss. 3, 2003-12 ,pp. : 8-14

Emerald Group Publishing Ltd

Access to resources Recommend Favorite