Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis

By Lee Chang-Chun   Chang Kuo-Chin   Yang Ya-Wen  

Soldering & Surface Mount Technology, Vol. 21, Iss. 1, 2009-02 ,pp. : 31-41

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

By Huang Meng-Kuang   Lee Chiapyng   Wu Pei-Lin   Tzan Shyh-Rong  

Soldering & Surface Mount Technology, Vol. 17, Iss. 3, 2005-09 ,pp. : 3-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Optimisation modelling for flip-chip solder joint reliability

By Stoyanov S   Bailey C   Cross M  

Soldering & Surface Mount Technology, Vol. 14, Iss. 1, 2002-01 ,pp. : 49-58

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Solder joint formation simulation and reliability study of quad flat no lead package

By Huang C. Y.   Wu Z. H.   Zhou D. J.  

Science and Technology of Welding & Joining, Vol. 12, Iss. 1, 2007-01 ,pp. : 100-105

Maney Publishing

Access to resources Recommend Favorite

Flip chip solder joint reliability under harsh environment

By Bo Cheng   Li Wang   Qun Zhang   Xia Gao   Xiaoming Xie   Kempe Wolfgang  

Soldering & Surface Mount Technology, Vol. 15, Iss. 3, 2003-12 ,pp. : 15-20

Emerald Group Publishing Ltd

Access to resources Recommend Favorite