Improving the fatigue life of a bare die flip chip by thinning

Author： Alander T.   Suominen I.   Heino P.   Ristolainen E.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.15, Iss.3, 2003-12, pp. : 8-14

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