TiN Metal Hardmask Residue Removal Formulation Development for Advanced Porous Low-K and Cu Interconnect Application

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2014|219|217-220

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2014, Iss.219, 2014-01, pp. : 217-220

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Abstract

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