Evaluation of Post Etch Residue Cleaning Solutions for the Removal of TiN Hardmask after Dry Etch of Low-k Dielectric Materials on 45 nm Pitch Interconnects

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2016|255|232-236

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2016, Iss.255, 2016-10, pp. : 232-236

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