Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

Author: Hongqi Jing   Li Zhong   Yuxi Ni   Junjie Zhang   Suping Liu   Xiaoyu Ma  

Publisher: IOP Publishing

ISSN: 1674-4926

Source: Journal of Semiconductors, Vol.36, Iss.10, 2015-10, pp. : 102006-102011

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Abstract