Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

Author: Zaal Jeroen J. M.   van Driel Willem D.   Zhang G.Q.  

Publisher: MDPI

E-ISSN: 1424-8220|10|4|3989-4001

ISSN: 1424-8220

Source: Sensors, Vol.10, Iss.4, 2010-04, pp. : 3989-4001

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract