Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Author： Fukushima Takafumi   Konno Takayuki   Iwata Eiji   Kobayashi Risato   Kojima Toshiya   Murugesan Mariappan   Bea Ji-Chel   Lee Kang-Wook   Tanaka Tetsu   Koyanagi Mitsumasa  

Publisher： MDPI

E-ISSN： 2072-666x|2|1|49-68

ISSN： 2072-666x

Source： Micromachines, Vol.2, Iss.1, 2011-02, pp. : 49-68

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