Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

Author： Thoma Florian   Goldschmidtböing Frank   Cobry Keith   Woias Peter  

Publisher： MDPI

E-ISSN： 2072-666x|5|3|783-796

ISSN： 2072-666x

Source： Micromachines, Vol.5, Iss.3, 2014-09, pp. : 783-796

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