Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface

E-ISSN： 1662-9779|2018|273|77-82

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2018, Iss.273, 2018-06, pp. : 77-82

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M. Punch J. Collins M. Ryan C.

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The compression stress-strain behavior of Sn-Ag-Cu solder

By Vianco Paul Rejent Jerome Martin Joseph

JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 50-55

Springer Publishing Company

Access to resources Recommend Favorite

Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

By Deng X. Sidhu R.S. Johnson P. Chawla N.

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 55-64

Springer Publishing Company

Access to resources Recommend Favorite

Reflow profile study of the Sn-Ag-Cu solder

By Salam B Virseda C Da H Ekere N.N. Durairaj R

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L. Perovic D. D. Rutter J. W.

Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. : 193-198

Maney Publishing

Access to resources Recommend Favorite